TEAM GROUP XTREEM 2X2GB DDR3 2200MHZ

Along with the introduction of Intel Core i7/i5 (Lynnfied, LGA 1156) and P55 chipsets, the future development is once again affirmed to follow the steps of Intel platforms and the excelled technology of IMC (integrated Memory Controller) memory profile. Thus, as a long standing developer in over-clocking memory modules, Team Group Inc leads the industry to launch its Xtreem LV DDR3 2200. Through the revolutionary development of Core i7/i5 memory profile from DDR3 1333MHZ to DDR3 2200, the frequency of clock ticks grew by 40%, and in addition to its excellent 35GB/Sec bandwidth, Xtreem LV DDR3 2200, as supported by the IMC framework, carries the mission to satisfy enthusiastic users.

Xtreem LV DDR3 2200 module is created by 128x8 high-rank granules, which comes in 1GB and 2GB capacities and dual-unit set double-channel packing to maximize stability and compatibility. In addition, Xtreem LV DDR3 2200 is also equipped with the exclusive Xtreem heat radiation chipset to ensure the stability under extreme speed. Excellent quality brings unique user experience. And that is not all. Xtreem LV DDR3 2200 also comes with high-efficiency 8-layer PCB and put under 100% burn test with comparison to the cross-platform motherboard tests of the leading brands. High performance of the Xtreem LV DDR3 2200 is achieved with only 1.65V of power, which prevents high voltage from causing damage to the CPU. The high-quality of Team Group is highly acclaimed in the market and trusted by users.

Suitable for Desktop PCs
Module Type 240Pin Unbuffered DIMM Non ECC
DRAM Density 128x8
Capacity 4GB Kit (2x2GB)
Data transfer
bandwidth 17,600MB/Sec (PC3 17600)
CL-value 9-9-9-24-2T
Working voltage 1.65V
PCB 8-layer PCB
Extra features Aluminum heat-sink
Warranty Lifetime warranty